We offer mutually beneficial cooperation and suggest considering the use of modified fluoroplast-4 (Ф-4РМ20) obtained by means of radiation and thermal processing of standard billets (bushings, rods, discs, plates and sheets) produced of polytetrafluoroethylene (PTFE).
Ф-4РМ20belongs to materials of the new generation and of new possibilities in the world of seals. It enables operation in extreme conditions in which well-known composites are destructed by pressure, temperature, friction or radiation. It has been developed in cooperation with specialists in radiophysics and polymer chemistry.
Characteristics |
Ф-4 |
Ф-4РМ20 |
Coefficient of friction in the pin-disc kinematic configuration |
0.06 – 0.08 |
0.06 – 0.08 |
Coefficient of friction in the shaft-bushing kinematic configuration |
0.10 – 0.12 |
0.08 – 0.14 |
Wear in the pin-disc kinematic configuration at the stress of 25 kg/cm2 and the sliding speed of 1m/s; mg/hour |
900 |
0.1 |
Wear in the shaft-bushing kinematic configuration at the stress of 6.8 kg/cm2 and the shaft rotation speed of 0.5 m/s; mg/m |
25 |
0.06 |
Tensile strength (film, 100 – 250 μm); MPa |
25 - 30 |
20 - 25 |
Tensile strength (plate, 2 mm); MPa |
20 - 25 |
15 - 20 |
Elongation at break, % |
350 - 450 |
300 - 400 |
Tensile modulus (plate, 2 mm); MPa |
280 |
350 |
Yield point (plate, 2 mm); MPa |
14 |
22 |
Creep at room temperature at the static loading stress of 70% of tensile strength, 100 hours; % |
150 |
1 - 2 |
Creep at 250 °C at the static loading stress of 0.5 MPa, 2 hours; % |
11 |
1.5 |
Compression deformation at the loading stress of 14 MPa, 24 hours; % |
16 |
10 |
Permanent compression deformation in 24 hours after the removal of load equaling 14 MPa; % |
75 |
0 |
Compression deformation at the loading stress of 28 MPa, 24 hours; % |
41 |
29 |
Permanent compression deformation in 24 hours after the removal of load equaling 28 MPa; % |
61 |
30 |
Dielectric permittivity at 109 Hz |
2.1 |
2.1 – 2.2 |
Dielectric absorption at 109 Hz |
2.0×10-4 |
(2.0 – 3.0) × 10-4 |
Optical transparency (film, 500 μm); % |
40 - 50 |
70 - 80 |
Melting point, °C |
327 |
300 |
Chemical resistance |
High |
No changes |
Radiation resistance, Mrad |
1 |
100 - 300 |
We are ready to provide trial samples of the material for testing.